IBM, Samsung Ink Agreement to Build Future Power Chips

https://www.extremetech.com/wp-content/uploads/2015/07/IBM-640x354.jpg 640w, https://www.extremetech.com/wp-content/uploads/2015/07/IBM-106x59.jpg 106w, https://www.extremetech.com/wp-content/uploads/2015/07/IBM-672x371.jpg 672w, https://www.extremetech.com/wp-content/uploads/2015/07/IBM.jpg 965w" sizes="(max-width: 300px) 100vw, 300px" /> IBM and Samsung have signed a deal for Samsung to build Power chips on its 7nm process. The post IBM, Samsung Ink Agreement to Build Future Power Chips appeared first on