Samsung’s new memory features Fan-Out, Wafer-Level Packaging. (Image: Samsung)
In the past, chip companies such as AMD have dabbled in High-Bandwidth Memory (HBM) instead of GDDR to increase memory bandwidth for GPUs. This vertically stacked memory boasts incredible bandwidth, but it’s a costly endeavor. AMD abandoned it in favor of GDDR memory after Samsung’s New GDDR6W Graphics Memory Rivals HBM2
Samsung’s new memory features Fan-Out, Wafer-Level Packaging. (Image: Samsung)
In the past, chip companies such as AMD have dabbled in High-Bandwidth Memory (HBM) instead of GDDR to increase memory bandwidth for GPUs. This vertically stacked memory boasts incredible bandwidth, but it’s a costly endeavor. AMD abandoned it in favor of GDDR memory after Subscribe to iCameroon.Com Newsletter
